After developing etching, the product waits to be removed

After the pattern is transferred, the photoresist is no longer needed, so it needs to be removed. There are usually two methods to remove glue: wet method and dry method. Wet method is to dissolve or corrode photoresist by using organic solvent or solution corrosive to photoresist, so as to achieve the purpose of removing glue. Here, the selection of removing glue solution needs to follow the prerequisite of reacting with the substrate or not damaging the substrate. Dry glue removal is to ash the photoresist by using oxygen plasma, so as to achieve the purpose of glue removal.

Wet method and dry method

No matter after dry etching or wet etching, the photoresist covering the finished circuit must be removed. Accordingly, the photoresist will be separated and removed by using a stripping solution to ensure the smooth progress of the next film formation.

No matter after dry etching or wet etching, the photoresist covering the finished circuit must be removed. Accordingly, the photoresist will be separated and removed by using a stripping solution to ensure the smooth progress of the next film formation.